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Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB pictures & photos
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
  • Factory Circuit OEM Design Service Double-Sided 4layers Immersion Tin 1oz Plated Copper Android Board Assembly FPCB
Insulation Materials: Epoxy Resin
Flame Retardant Properties: V0
Application: Consumer Electronics
Layers: 32 Layers
Min Track / Spacing: 0.075 mm / 0.075 mm
Min Hole Size: 0.10 mm
Customization:

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