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Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB pictures & photos
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
  • Other &PCBA Clone Reverse Engineering Printed Circuit Board Blind and Buried HDI Laser Board Flexible FPC Boards PCB
Insulation Materials: Epoxy Resin
Flame Retardant Properties: V0
Application: Consumer Electronics
Layers: 32 Layers
Min Track / Spacing: 0.075 mm / 0.075 mm
Min Hole Size: 0.10 mm
Customization:

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