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Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier pictures & photos
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
  • Custom Thermoelectric Separation Heavy Gold and Copper 2layer 1.6mm Minimum Hole Multilayer PCB Repair Supplier
Type: Combining Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Application: Aerospace
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Customization:

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