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Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB pictures & photos
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
  • Rogers4350 and Metal Core Base Material Chemical Tin Precipitation 2 Step 3layer HDI Multilayer PCB
Type: Combining Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Application: Aerospace
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Customization:

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